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  • Solving thermal problems before hardware is built
  • Reducing design re-spins and product unit cost
  • Improving reliability and overall engineering design
  • Significantly reducing time to market.


Perform thermal analysis, create virtual models, and test design modifications of electronic equipment before physical prototyping

FloTHERM uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems, including racks and data centers. It’s also the industry’s best solution for integration with MCAD and EDA software.

FloTHERM is the undisputed world leader for electronics thermal analysis, with a 98 percent user recommendation rating. It supports more users, application examples, libraries and published technical papers than any competing product.

  • Market leader since 1989
  • 9 out of 10/17 out of 20 of the top consumer electronics companies rely on FloTHERM for thermal design
  • Data-interoperable, supporting import of measurement-based thermal models from T3Ster and DynTIM
  • Closely integrated with MCAD and native EDA interfaces
  • Meshing and solution technologies ensure fastest time-to-results to keep pace with design changes
  • Handles industrial-strength cases with many thousands of objects and millions of mesh cells
  • Fully-automated integral design optimization capability using the FloTHERM Command Center module
  • Full XML import capability and result post-processing to support workflow automation
  • FloVIZ, a free post-processing module, shares FloTHERM results with other stakeholders in today’s highly-collaborative design environment

FloTHERM Products Family

Optimize thermal design of your electronics in a non-CAD environment.

FloTHERM uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems, including racks and data centers. It’s also the industry’s best solution for integration with MCAD and EDA software.

FloTHERM is the undisputed world leader for electronics thermal analysis, with a 98 percent user recommendation rating. It supports more users, application examples, libraries and published technical papers than any competing product.

Accelerated Thermal Design Workflow

FloTHERM integrates with popular MCAD and EDA tools. Its XML import capability simplifies building and solving models,  post-processing results automatically. FloTHERM‘s automatic sequential optimization and DoE capabilities reduces the time it takes to reach optimized design, allowing it to be deeply embedded in the design flow.

FloTHERM - Robust Meshing and Fast SolverRobust Meshing and Fast Solver

FloTHERM lets engineers focus on design, delivering the most accurate results possible within engineering timescales. Its SmartParts and structured-Cartesian method offers the fastest solution time per grid cell. The FloTHERM “localized-grid” technique supports integrally matched, nested, non-conformal grid interfaces between different parts of the solution domain.



FloTHERM - Usability and Intelligent Thermal ModelsUsability and Intelligent Thermal Models

Integral model checking in FloTHERM lets users see which objects have attached material, the power attached to every object, and corresponding assembly-level power dissipation. It also identifies whether the object is creating a mesh line.

FloTHERM SmartParts represent ICs to full racks of electronics from a large list of suppliers, streamlining model creation to minimize solve times and maximize solution accuracy

FloTHERM - Thermal Characterization and Analysis from Component to SystemThermal Characterization and Analysis from Component to System

Combine FloTHERM with T3Ster transient thermal characterization for thermal simulation of real-world electronics. Since reliability of components can decrease exponentially due to heat problems, using T3Ster lets manufacturers design chips, ICs, and PCBs of superior thermal performance. They can also publish reliable thermal data for downstream applications.

Now FloTHERM can convert a simulated transient thermal response into a structure function curve using the same mathematical process utilized by T3Ster.  These structure function curves are known to correlate with the physical structure of the device, and are thus the ideal platform to compare simulation results with actual test data. FloTHERM’s Command Center now provides automated calibration of the package thermal model to match the T3Ster results, ensuring the correct thermal response irrespective of the length of the power pulse. Equipment manufacturers and systems integrators can now use calibrated models to design even more reliable products, avoiding thermally-induced failures throughout the product’s lifetime.

Image result for flotherm xtCAD-centric thermal CFD from conceptual design to manufacture

FloTHERM XT is a unique, award-winning thermal simulation solution that can be used during all stages of the electronics design process – from conceptual design to manufacturing – improving product quality, reliability and time-to-market.

It features the electronics cooling DNA of market-leading FloTHERM® thermal analysis software, and concurrent computational fluid dynamic (Concurrent CFD) technology from FloEFD™.

FloTHERM XT: Compress the Electronics Thermal Design ProcessCompress the Electronics Thermal Design Process

FloTHERM XT tightly couples the MCAD and EDA design flows and cuts design process times by factor of at least 2 when compared to traditional general-purpose simulation products. This enables designers and thermal specialists to quickly and efficiently arrive at an optimum solution.




FloTHERM XT: New CAD-centric Approach to Thermal EngineeringNew CAD-centric Approach to Thermal Engineering

A CAD-centric user interface, as well as geometry engine for complex and arbitrary shaped geometries, enables users to quickly become productive. FloTHERM XT offers CAD connectivity and advanced CAD modeling capabilities which considerably shorten the learning curve.

FloTHERM XT: Fast, Accurate Model Creation and SimulationFast, Accurate Model Creation and Simulation

Full geometric and non-geometric SmartParts and library capabilities enable users to access a full set of the most popular components for fast and accurate model creation.



FloTHERM XT: Parametric Studies for Optimized DesignsParametric Studies for Optimized Designs

FloTHERM XT’s fully integrated environment for defining, solving and analyzing results using parametric variations of geometry, attributes (e.g. material, thermal) plus solution parameters significantly enhances the design optimization process. Its “Design of Experiments” scenario table allows users to set up a number of studies to ensure the best coverage of the design field. These scenarios may also be sent to remote machines with more capacity.

FloTHERM XT: Advanced EDA InterfacingAdvanced EDA Interfacing

FloTHERM XT’s interoperability with PCB design flows reduces time-consuming data translation and costly errors. It provides an easy and intuitive direct interface to Mentor Xpedition® and its ODB++ interface supports Cadence, Zuken and Altium. Any board and component layout can be imported and easily modified for position, size, orientation, shape and modeling level prior to transfer to FloTHERM XT. And with the addition of thermal territory simulation, FloTHERM XT supports detailed copper “under the component” models which are used to draw heat away from that component, further improving accuracy. That is why FloTHERM XT is the only solution on the market that allows engineers to work effortlessly with geometry created in the MDA or EDA world.

Collaboration tool for everyone concerned with conceptual PCB thermal design

10 Tips for Streamlining PCB Thermal Design… A High-Level ‘How To’ Guide

FloTHERM PCB is a unique, radical software program for streamlining concept development of printed-circuit boards (PCBs), while ensuring good thermal design and accelerating the PCB design process.

FloTHERM PCB facilitates collaboration between product marketing, electronic engineers and mechanical engineers on PCB design, particularly during the conceptual phase of the design process.


  • Direct interfaces to Mentor Expedition, Boardstation and other popular board layout tools that automatically extract and build:
    • Board outline, cutouts, and thickness
    • Component position, size, and orientation
    • Layer stackup
    • Detailed descriptions of the copper content (traces, pads, vias, etc) in image format. These images are transformed into a thermal conductivity map (with user controlled resolution) for the board with a novel and unique image processing technique.
  • Property sheet driven construction of electronics objects and cooling solutions:Components
    • Heatsinks
    • Thermal vias
    • Daughterboards
    • Shielding cans
    • Potting compounds
  • Fully integrated library capabilityPre-installed with a comprehensive component library
    • Fully customizable
    • Direct library item swapping
    • Automatic library item swapping for components
  • Import capability for part models and library folders generated with other Mentor thermal tools such as FloTHERM and FloTHERM PACK.
  • Update functionality for the board layout. A layout change can be imported without loss of other model settings and data (e.g., heatsink geometry, power definitions, etc.)

Environment Definition

Parametrically defined thermal environment to house the PCB, with options available for:

  • Card slots
  • Natural convection
  • Forced convection
  • Conduction-cooled

For more advanced scenarios, pre-solved FloTHERM analyses can be imported to form a complex, 3D description of the surrounding air flow and temperature fields.


The state of the art FloTHERM PCB solver predicts airflow and temperature in a matter of minutes for most designs — no user interaction required for gridding or solving.




Create customized results with a single mouse-click. Plots are available for:

  • Junction temperatures
  • Case temperatures
  • Average temperatures
  • Thermal margins

Generate sortable, tabular views of the data automatically. Multiple designs can displayed side by side for easy results comparison. Fully customizable reports are available for export. Reports can contain any combination of board inputs, environment settings, or result plots and tables. Reports are available in HTML or CSV formats.


Command line operation is supported. Users can load designs, import board data, solve, and create reports without opening the software.


10 Tips for Predicting Component Temperatures… A High-Level ‘How To’ GuideAutomated, simulation-based IC package thermal characterization

FloTHERM® PACK is a unique, web-based solution that easily generates reliable, accurate thermal models of IC components, test boards, standard test harnesses and other associated parts 20 times faster than conventional approaches.



The Fastest PCB Thermal Design for Mechanical EngineersThe Fastest PCB Thermal Design for Mechanical Engineers

About half of FloTHERM PCB customers surveyed were able to qualify the thermal impact of changes to their PCB designs in real time, with more than three-quarters qualifying the design daily. This unique capability provides thermal feedback to designers in sync with design iterations

FloTHERM PACK supplies the world’s package thermal modelsFloTHERM PACK supplies the world’s package thermal models

With hundreds of FloTHERM PACK users downloading thousands of compact models per month, FloTHERM PACK has become the de facto industry standard for thermal model creation. Coupled with market-leading FloTHERM, it yields unprecedented usability, capability and ultimately productivity.

Generate thermal models 20X faster than conventional approachesGenerate thermal models 20X faster than conventional approaches

FloTHERM PACK’s JEDEC Standard Outline SmartPart wizard allows representative models of packages to be created with just a few mouse clicks. More than 40 popular package styles supported including ball grid arrays, leaded packages, pin grid arrays, discrete transistor outline packages, chip-scale packages, including multi-die packages.

Generate state-of-the-art detailed and compact models of IC componentsGenerate state-of-the-art detailed and compact models of IC components

FloTHERM PACK worksheets provide access to all the information used to generate detailed and compact thermal models, allowing detailed information about the package internals to be captured. It is the only commercial software tool that can actually generate high-accuracy DELPHI compact models at Network Assembly SmartParts for FloTHERM and FloTHERM XT.

Supply chain integrationSupply chain integration

Communicate thermal information to your external vendors or customers in a standardized manner. Share and archive thermal libraries within an organization using the unique workgroup feature. Publish models for use by your customers, helping your business and increasing customer satisfaction.

Web-based IC package thermal characterization tool for semiconductor manufacturers. FloTHERM IC delivers unprecedented automation and productivity in generating thermal metrics.

FloTHERM® IC is a web-based tool that incorporates a high level of automation for semiconductor thermal characterization and design tasks. Built around FloTHERM PACK, the well-established package SmartPart technology, and FloTHERM CFD solver technology, FloTHERM IC greatly boosts productivity of thermal analysts in the semiconductor industry.

High Level of Automation

High Level of Automation

A typical semiconductor thermal group spends approximately 60 percent of its time on standard package thermal characterization, according to Mentor Graphics research.

FloTHERM IC slashes that time, and for the first time enables non-expert users to generate metrics for their customers, freeing thermal specialists to focus on the tougher issues requiring their expertise.


Designed for Semiconductor Packaging Engineers

Designed for Semiconductor Packaging Engineers

About 40 percent of a typical semiconductor thermal group’s time is spent on customer-specific simulations. FloTHERM IC cuts that time by about 25 percent, further freeing packaging engineers to work on higher-value design activities.

Established, Proven Technology

Established, Proven Technology

FloTHERM IC delivers the model-building and simulation technology for metrics and compact thermal models found in FloTHERM PACK to packaging engineers. It offers a SmartPart-based architecture to support package model development.

Sensitivity Analysis Capability

Sensitivity Analysis Capability

Investigate the influence of key package parameters such as die size, power, die attach conductivity, lead pitch etc. on any JEDEC metric or compact model in just a few mouse clicks, making it easy to optimize the thermal design.

The best of both worlds – Flexx licensing allows companies to use FloTHERM and FloTHERM XT to solve electronics cooling design challenges

Solving different thermal design challenges requires the right tool. Perform thermal analysis using the most appropriate award-winning solution for the task at hand when you need it.


The de-facto standard and specialized solution for the electronics thermal market offers innovative SmartPart technology, extensive libraries, state-of-the art compact thermal modelling techniques and parametric analysis and optimization functionality.


 A CAD-centric approach to thermal engineering through CAD connectivity and advanced CAD modelling capabilities. It can be used during all stages of the electronics design process – from  concept design including advanced to advanced EDA interfacing technologies with best-in-class interoperability with Xpedition® Enterprise to manufacturing.


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